With HiFocus neo the user benefits from high speed when cutting and marking electrically conductive materials, ensuring at the same time excellent quality and low process costs. Thanks to the optimised technology, the consumables are handled gently and the plasma cutting process is more efficient. The plasma cutting unit HiFocus 130 neo achieves best results when marking and cutting materials with a thickness from 0.5 to 40 mm.
Power source | HiFocus 130 neo |
|---|---|
Mains voltage* | 3x 400 V, 50 Hz |
Fuse, slow | 50 A |
Connected load, max. | 32 kVA |
Cutting current (at 100% duty cycle) | 20 – 130 A |
Marking current | 16 A |
Cutting range | 0.5 – 40 mm |
Dimensions (L x W x H) | 960 x 540 x 1050 mm |
Weight | 251 kg |
Plasma torch | PerCut 201 / 211 |
*Other voltages and frequencies available upon request.